Techmer PM will exhibit for the first time at Multilayer Packaging Films 2017 on June 27-28 at the Marriott O’Hare in Chicago.
The eighth-annual business and technology conference, planned by Applied Market Information LLC (AMI), is an international meeting for companies immersed in the manufacture and specification of film packaging. The conference will delve into both technical and commercial topics, including: new films and materials; barrier properties and testing; production technology such as co-extrusion and coating; as well as applications and markets.
At its booth, Techmer PM will showcase its anti-fog technology for food packaging applications. To schedule a meeting in advance of the event, please send an email to Kdailey@techmerpm.com.
For more information about the event, please visit the AMI website.